Dual-tower and dual-fan design：Two sets of heat dissipation fins + dual fans (usually standard with the T1-C12 series) significantly increase the heat dissipation area and air volume, easily suppressing cpus with 200W+ TDP (such as i9-13900K, Ryzen 9 7950X).
6 Heat Pipe Configuration：It adopts 6mm sintered heat pipes (AGHP anti-gravity heat pipe technology) to optimize heat conduction efficiency, maintaining performance even when placed vertically in the chassis.
Fin optimization：High-density aluminum fins + folded Fin process enhance airflow penetration and reduce wind resistance.
Low-noise fan：Standard TL-C12 fan (1500 RPM± 10%) Supports PWM speed regulation, noise ≤ 25.6dB(A), balancing performance and quietness.
Dual-mode installation：Detachable single fan (compatibility priority) or dual fans (performance priority), flexibly adapting to different needs.
Full-platform support：Compatible with Intel LGA1700/1200/115x and AMD AM5/AM4, no additional fasteners are required.
Memory avoidance design：The tower body offset design (such as raising the front end) avoids blocking the high armor memory (such as Royal Halberd, Phantom Light Halberd), and supports memory height ≤ 55mm (can be higher in single-fan mode).
Simple fasteners：It is fixed with a metal back plate and spring screws, ensuring strong installation stability.
Give way to the graphics card：The thickness of the tower body is approximately 125mm and it usually does not conflict with the PCIe slot (the specific size needs to be referred to the chassis size).
Chassis compatibility：Case compatibility 160mm (to avoid side plate conflicts).
Memory height：If dual fans and high memory are used, the fan positions may need to be adjusted.
